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MIL-HDBK-103AD

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MIL-HDBK-103AD, DEPARTMENT OF DEFENSE HANDBOOK: LIST OF STANDARD MICROCIRCUIT DRAWINGS (26 MAR 2009)., The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP will be the avenue for screening candidate parts for the SMDP by the DSCC Military Parts Control Advisory Group (MPCAG).
 

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【英文标准名称】:Firehazardtesting-Part8-1:Heatrelease-Generalguidance
【原文标准名称】:着火危险试验.第8-1部分:放热.一般指南
【标准号】:IEC60695-8-1-2008
【标准状态】:现行
【国别】:国际
【发布日期】:2008-03
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC89
【标准类型】:()
【标准水平】:()
【中文主题词】:二氧化碳;定义;测量规程;电气工程;电工产品;着火危险试验;火势蔓延;火灾危险;燃烧试验;火焰传播;火焰扩散;气体温度;指导手册;危害;燃烧热;放热率;材料;氧消耗;测试;试验条件;热输出
【英文主题词】:Carbondioxide;Definitions;Determinationprocedures;Electricalengineering;Electrotechnicalproducts;Evaluations;Firehazardtest;Firepropagation;Firerisks;Firetests;Flamepropagation;Gastemperature;Guidebooks;Hazards;Heatofcombustion;Heatrelease;Heatreleaserate;Materials;Oxygenconsumption;Testing;Testingconditions;Thermaloutput
【摘要】:ThispartofIEC60695providesguidanceonthemeasurementandinterpretationofheatreleasefromelectrotechnicalproductsandmaterialsfromwhichtheyareconstructed.Heatreleasedatacanbeusedaspartoffirehazardassessmentandinfiresafetyengineering,asdescribedinthefutureIEC60695-1-10[1]andthefutureIEC60695-1-1112].ThisbasicsafetypublicationisintendedforusebytechnicalcommitteesinthepreparationofstandardsinaccordancewiththeprincipleslaiddowninIECGuide104andISO/IECGuide51.Oneoftheresponsibilitiesofatechnicalcommitteeis,whereverapplicable,tomakeuseofbasicsafetypublicationsinthepreparationofitspublications.Therequirements,testmethodsortestconditionsofthisbasicsafetypublicationwillnotapplyunlessspecificallyreferredtoorincludedintherelevantpublications.
【中国标准分类号】:K09
【国际标准分类号】:13_220_40;29_020
【页数】:50P;A4
【正文语种】:英语